According to an early morning press release from Barcelona Spain at the 2008 Mobil World Congress.

Broadcom announced today a new HEDGE reference design platform (Broadcom BCM92153) that will significantly accelerate the process of developing next generation smartphones for mass consumer handsets. The new reference design is based on Broadcom's breakthrough 65-nanometer single-chip dual-core HSDPA + EDGE multimedia baseband processor and integrates the leading connectivity solutions on a compact, cost-efficient platform featuring all-Broadcom(R) silicon for the major communications components.

Back in October of 2007, Broadcom introduced the BCM2153 3G baseband processor and the BCM59035 power management unit, which we reviewed. These devices have now been combined into a complete reference platform to help developers evaluate and incorporate these devices into their next handset designs.

The new HEDGE reference design platform integrates a HSDPA baseband modem (with world-class application, audio and multimedia processors) and a Category 8 HSDPA modem (that delivers 7.2 Mbps third generation (3G) connectivity for advanced applications) on a single monolithic chip. The platform provides demonstrated support for the three major mobile operating systems. Advanced connectivity features include Broadcom's industry proven Bluetooth(R), Wi-Fi(R), GPS and FM radio technology, along with advanced digital image processing that features support for an up to 3.2 megapixel camera built in. With this level of integration, the new HEDGE reference design platform requires less board space, cost and power than competing solutions, provides fast time-to-market and eliminates the cost premium typically associated with HSDPA handsets today.

With what the iPhone and iPod Touch offer, this chip set could be what we've been waiting for to get the next generation Apple product to market. Since Broadcom is already providing chips to the manufacture of current models, although none are used for any of the included radios (iPhone, iPod Touch), it is only logical that some of these new chips are already being incorporated in to engineering breadboard designs for evaluation and possible inclusion in the Gen 2 products. Some of the features that the chip includes are:

- HSDPA connectivity for the highest available cellular bandwidth available.
- Advanced multimedia capabilities, including support for H.264 video and high quality digital photographs.
- Wi-Fi to provide high speed local area connectivity for viewing web pages or downloading large media files from the Internet.
- Bluetooth to enable hands free communications and wireless synchronization with PCs or other devices.
- GPS to allow location based services, such as navigation and mapping offerings tied to directory assistance to help consumers find their locations.
- FM radio to allow a connection to live broadcasts, such as sports and news, and also to connect phones and media players to in-car stereo systems.

In the past, handset makers have had to rely upon multiple vendors to attempt to enable these various capabilities, requiring the investment of significant resources to develop platforms around multiple software approaches and disparate component system architectures. Today, Broadcom introduces an integrated design platform that addresses many existing design limitations, accelerates time-to-market and opens up new possibilities for a full range of HSDPA handset designs.

Let us know what you think over in the comments and forums.