Rumored 3D sensing camera module for next-gen iPhone leaked

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Date: Wednesday, August 23rd, 2017, 05:39
Category: Hardware, iPhone, Rumor, Touch ID

As of late Monday, a leaked photo had surfaced of an alleged leaked 3D sensing camera module destined for the upcoming “iPhone 8”. Apple is said to have radically revamped its front-facing camera for its OLED iPhone, adding 3D sensing capabilities for facial recognition.

The leak dovetails with KGI Securities’ Ming-Chi Kuo having stated that the next-gen iPhone’s camera will consist of three modules: a standard camera front-facing camera module, an infrared transmitting module, and an infrared receiving module, all of which will allow the iPhone 8 to perform 3D sensing and modeling functions.

It’s also been rumored that the front facing camera might support 4K video recording at 60 frames per second. The rumor is based on code references found without the HomePod firmware leak. It’s also been argued that this feature could be limited to the rear camera as opposed to the rear camera.

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Rumor: Case manufacturer Nodus cites lack of Touch ID on next-gen iPhone

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Date: Monday, August 21st, 2017, 05:26
Category: Hardware, HomePod, iPhone, Rumor, Touch ID

Sometimes it’s the case and accessory designers that have the most information about an upcoming Apple product.

Accessory maker Nodus has finalized the case design for Apple’s next-gen iPhone. The overall design appears largely congruent with recent parts leaks and supposed insider information, featuring a nearly bezel-free full-face display with telltale sensor “notch.”

Interestingly, Nodus’ design seems to corroborate the findings in Apple’s HomePod firmware leak. Specifically, the “iPhone 8” software will include graphical assets like a split status bar to present the sensor “notch” as an integrated piece of the onscreen UI.

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Intel publishes details regarding “Ice Lake” processors prior to release of Coffee Lake, Cannon Lake processors

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Date: Thursday, August 17th, 2017, 05:07
Category: Hardware, Intel, News, Processors

With its 8th-generation Coffee Lake processors arriving next week, Intel has released information pertaining to its upcoming 10-nanometer “Ice Lake” chip, which will serve as the successor to the 14-nanometer Coffee Lake and 10-nanometer Cannon Lake chips.

The company stated that “the Ice Lake processor family is a successor to the 8th generation Intel(R) CoreTM processor family. These processors utilize Intel’s industry-leading 10 nm+ process technology,” via its codename decoder web site.

The timing comes as irregular, as Intel has not announced or shared details on its Cannon Lake processor. The Cannon Lake line will represent the first chips that will be built on its 10-nanometer architecture, and Intel is also referring to Ice Lake as the successor to its soon-to-be-announced 14-nanometer Coffee Lake chips, leading to confusion about its upcoming processor lineup and how Cannon Lake fits in.

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Rumor: Next-gen Apple Watch may feature LTE support, but focus on data instead of cellular phone calls until end of 2017

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Date: Thursday, August 17th, 2017, 05:13
Category: Apple Watch, Hardware, Rumor, Software, Wearables

The next-gen Apple Watch may arrive with LTE, but it may focus the LTE data on serving FaceTime and app data needs as opposed to making cell phone calls.

Per a note released to investors on Wednesday, KGI Securities analyst Ming-Chi Kuo predicted that the Apple Watch with LTE won’t support traditional cellular voice calls this year.

Kuo claimed that Apple will probably add support for calls in a future software update. Until then, apps such as FaceTime and Skype could serve as stand-ins for calls.

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Rumor: Next-gen iPhone could see increased thickness with switch to glass backing

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Date: Wednesday, August 16th, 2017, 05:33
Category: Hardware, iPhone, Rumor

The next-gen iPhone could be a bit thicker than the current model.

A current rumor has it that one planned change for the 4.7-inch and 5.5-inch iPhones expected next month is a material return from aluminum backs to glass, and now a new rumor claims that shift will result in a slightly thicker casing.

Giga Apple, a German web blog, has cited a case maker who claims to have contacts within iPhone maker Foxconn. The blog has reported at least a 0.1mm increase in thickness. The blog quoted a leaked spec document that stated that the upcoming iPhone 7s will have a slight increase on all dimensions.

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TSMC enters mass production of 10-nanometer A11 processors

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Date: Tuesday, August 15th, 2017, 05:02
Category: Hardware, iPhone, News, Processors

Processor manufacturer TSMC has reportedly entered the mass production stage of its 10-nanometer “A11” processors for Apple’s next-gen iPhone.

While the new iPhone’s ship date has yet to be announced, TSMC is said to be applying the same 10-nanometer FinFET manufacturing technique being used to make A10X chips for this year’s 10.5- and 12.9-inch iPad Pros. The A10X is in fact believed to be the first chip produced with the technique, though TSMC does have other clients.

At present, the A10 processor used in the iPhone 7 and 7 Plus handsets feature a 16-nanometer design. The smaller size of the new processor could allow for better performance in a similarly-sized package and help improve power efficiency.

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Rumor: Third-gen Apple Watch to arrive in LTE and non-LTE models

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Date: Tuesday, August 15th, 2017, 05:36
Category: Apple Watch, Hardware, Rumor, Wearables

KGI Securities analyst Ming-Chi Kuo has released a new research note and has predicted that the Apple Watch 3 will ship later this year with both LTE and non-LTE models offered. Kuo also expects the next Apple Watch will retain the same general design and not feature an obvious new form factor.

Kuo added that the Apple Watch will probably continue to ship in 38mm and 42mm size configurations.

The prediction comes 10 days after Bloomberg’s report that the Apple Watch may feature Intel modems for LTE connectivity.

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Intel, Toyota, other firms create consortium to help resolve big data issues in self-driving car market

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Date: Monday, August 14th, 2017, 05:57
Category: Apple Car, Hardware, News, Software, Uncategorized

A number of tech and automotive firms including Intel, Toyota, and Ericsson announced the creation of a consortium that will focus on building a “big data” ecosystem for self-driving cars. The consortium will also focus on technologies such as driver assistance and using real-time data.

Other partners in the Automotive Edge Computing Consortium (AECC) include Japanese carrier NTT DoCoMo, and auto parts maker Denso. The automaker said that data traffic between vehicles and cloud servers is predicted to hit 10 exabytes per month by 2025, creating the need for “new architectures of network and computing infrastructure” to handle it.

The consortium will also “define requirements and develop use cases for emerging mobile devices with a particular focus on the automotive industry, bringing them to standards bodies, industry consortiums and solution providers.”

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Leaked HomePod firmware hints at resizable virtual Home button for iPhone 8

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Date: Friday, August 11th, 2017, 03:20
Category: Developer, Hardware, HomePod, iPhone, News

It’s the leaked firmware that keeps on giving.

In a recent discovery, developer Steve Troughton-Smith found code strings within the HomePod firmware that indicated a virtual Home button for the iPhone 8. The Home button can apparently be hidden and resized as needed.

There apparently isn’t a way to change the Home button’s color, and tab bars that display at the bottom of apps will appear below the button.

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Rumor: Apple places order in excess of $200 million with 3D sensing provider Lumentum ahead of iPhone 8 production

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Date: Thursday, August 10th, 2017, 02:31
Category: Hardware, iPhone, Rumor

Apple has apparently placed over $200 million in bookings with supplier Lumentum for the rest of the 2017 calendar year. The components are apparently related to vertical-cavity surface-emitting lasers (VCSEL) and are believed to be aimed at Apple’s advanced 3D sensing camera on the iPhone 8. The bookings represent a noticeable increase in revenue for the supplier, in comparison to a reported $5 million in 3D sensing revenue during its last fiscal quarter.

As a result, LoupVentures analyst Gene Munster has stated that he believes the September launch of the iPhone 8 will see a notable increase in the number of iPhones equipped with 3D sensors supporting augmented reality features. Lumentum is believed to be one of around three companies supplying Apple with VCSEL components, as well as Finisar.

Munster offered the following comments:

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