Purported photos of iPhone 7s components, including logic board and A11 processor, leaked

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Date: Monday, August 28th, 2017, 05:35
Category: Hardware, iPhone, Processors, Rumor

A series of leaked photos has shown what might be iPhone 7s components.

The photos, tweeted by Benjamin Geskin, show what is purported to be an A11 processor, a logic board and other components.

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Apple confirms plans for $1.3 billion Iowa data center, looks to begin construction in 2018

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Date: Friday, August 25th, 2017, 05:55
Category: Hardware, News

Apple on Thursday confirmed plans that the company plans to create a new data center in Waukee, Iowa. The project, which will cost $1.3 billion, is also expected to provide up to $100 million more for a “Public Improvement Fund.”

The complex, near Des Moines, will span 400,000 square feet, and handle services like Siri, iMessage, and the App Store, Apple said. Power will stem entirely from renewable energy, including “wind and other sources.”

The $100 million Public Improvement Fund will be managed by the City of Waukee and provide support for “community projects like parks, libraries and recreational spaces, as well as infrastructure needs.” The first major project financed by this fund will feature construction of the Waukee Youth Sports Campus, which will include fields, a greenhouse, a playground, and even a fishing pier.

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Newly published patent applications note possible Apple Pencil support on next-gen iPhones

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Date: Friday, August 25th, 2017, 05:32
Category: Apple Pencil, Hardware, iOS, iPhone, Rumor

Roughly a year ago, Apple CEO Tim Cook mentioned that he had used an Apple Pencil on an iPhone.

On Thursday, Patently Apple noted a series of patents describing this, publishing two of them in the process:

Today two more patent applications from Apple about Apple pencil working with a smartphone have surfaced. For the first time, Apple’s patent verbiage actually listed the ‘iPhone’ as a target product for Apple Pencil.

In patent application 20170242499 titled “Noise Correction for a Stylus Touch Device,” Apple notes that their patent figure 1 shows a touch screen such as a ‘smartphone or tablet.’ The patent later specifically clarifies that the smartphone and tablet are indeed an iPhone and iPad.

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Rumor: Apple could be slating September 12th for next-gen iPhone announcement, wireless carriers to focus on date

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Date: Thursday, August 24th, 2017, 05:34
Category: Hardware, iPhone, retail, Rumor

It looks like Apple’s next iPhone event will take place on September 12th.

Citing a number of wireless carrier sources, Mac news site Mac4Ever says that mobile phone operators have already been told when to expect the Apple announcement as they have to prepare inventory and marketing for the imminent new devices.

While Apple has yet to release an official statement, the likely dates in the past have put the event between September 6th and the 12th.

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Rumored 3D sensing camera module for next-gen iPhone leaked

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Date: Wednesday, August 23rd, 2017, 05:39
Category: Hardware, iPhone, Rumor, Touch ID

As of late Monday, a leaked photo had surfaced of an alleged leaked 3D sensing camera module destined for the upcoming “iPhone 8”. Apple is said to have radically revamped its front-facing camera for its OLED iPhone, adding 3D sensing capabilities for facial recognition.

The leak dovetails with KGI Securities’ Ming-Chi Kuo having stated that the next-gen iPhone’s camera will consist of three modules: a standard camera front-facing camera module, an infrared transmitting module, and an infrared receiving module, all of which will allow the iPhone 8 to perform 3D sensing and modeling functions.

It’s also been rumored that the front facing camera might support 4K video recording at 60 frames per second. The rumor is based on code references found without the HomePod firmware leak. It’s also been argued that this feature could be limited to the rear camera as opposed to the rear camera.

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Rumor: Case manufacturer Nodus cites lack of Touch ID on next-gen iPhone

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Date: Monday, August 21st, 2017, 05:26
Category: Hardware, HomePod, iPhone, Rumor, Touch ID

Sometimes it’s the case and accessory designers that have the most information about an upcoming Apple product.

Accessory maker Nodus has finalized the case design for Apple’s next-gen iPhone. The overall design appears largely congruent with recent parts leaks and supposed insider information, featuring a nearly bezel-free full-face display with telltale sensor “notch.”

Interestingly, Nodus’ design seems to corroborate the findings in Apple’s HomePod firmware leak. Specifically, the “iPhone 8” software will include graphical assets like a split status bar to present the sensor “notch” as an integrated piece of the onscreen UI.

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Intel publishes details regarding “Ice Lake” processors prior to release of Coffee Lake, Cannon Lake processors

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Date: Thursday, August 17th, 2017, 05:07
Category: Hardware, Intel, News, Processors

With its 8th-generation Coffee Lake processors arriving next week, Intel has released information pertaining to its upcoming 10-nanometer “Ice Lake” chip, which will serve as the successor to the 14-nanometer Coffee Lake and 10-nanometer Cannon Lake chips.

The company stated that “the Ice Lake processor family is a successor to the 8th generation Intel(R) CoreTM processor family. These processors utilize Intel’s industry-leading 10 nm+ process technology,” via its codename decoder web site.

The timing comes as irregular, as Intel has not announced or shared details on its Cannon Lake processor. The Cannon Lake line will represent the first chips that will be built on its 10-nanometer architecture, and Intel is also referring to Ice Lake as the successor to its soon-to-be-announced 14-nanometer Coffee Lake chips, leading to confusion about its upcoming processor lineup and how Cannon Lake fits in.

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Rumor: Next-gen Apple Watch may feature LTE support, but focus on data instead of cellular phone calls until end of 2017

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Date: Thursday, August 17th, 2017, 05:13
Category: Apple Watch, Hardware, Rumor, Software, Wearables

The next-gen Apple Watch may arrive with LTE, but it may focus the LTE data on serving FaceTime and app data needs as opposed to making cell phone calls.

Per a note released to investors on Wednesday, KGI Securities analyst Ming-Chi Kuo predicted that the Apple Watch with LTE won’t support traditional cellular voice calls this year.

Kuo claimed that Apple will probably add support for calls in a future software update. Until then, apps such as FaceTime and Skype could serve as stand-ins for calls.

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Rumor: Next-gen iPhone could see increased thickness with switch to glass backing

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Date: Wednesday, August 16th, 2017, 05:33
Category: Hardware, iPhone, Rumor

The next-gen iPhone could be a bit thicker than the current model.

A current rumor has it that one planned change for the 4.7-inch and 5.5-inch iPhones expected next month is a material return from aluminum backs to glass, and now a new rumor claims that shift will result in a slightly thicker casing.

Giga Apple, a German web blog, has cited a case maker who claims to have contacts within iPhone maker Foxconn. The blog has reported at least a 0.1mm increase in thickness. The blog quoted a leaked spec document that stated that the upcoming iPhone 7s will have a slight increase on all dimensions.

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TSMC enters mass production of 10-nanometer A11 processors

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Date: Tuesday, August 15th, 2017, 05:02
Category: Hardware, iPhone, News, Processors

Processor manufacturer TSMC has reportedly entered the mass production stage of its 10-nanometer “A11” processors for Apple’s next-gen iPhone.

While the new iPhone’s ship date has yet to be announced, TSMC is said to be applying the same 10-nanometer FinFET manufacturing technique being used to make A10X chips for this year’s 10.5- and 12.9-inch iPad Pros. The A10X is in fact believed to be the first chip produced with the technique, though TSMC does have other clients.

At present, the A10 processor used in the iPhone 7 and 7 Plus handsets feature a 16-nanometer design. The smaller size of the new processor could allow for better performance in a similarly-sized package and help improve power efficiency.

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