Intel licenses ARM to use chip manufacturing capacity

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Date: Wednesday, August 17th, 2016, 05:47
Category: Hardware, Intel, News, Processors

IntelLogo

Intel has announced that it’s licensing technology from rival ARM Holdings Plc.

The two chipmakers unveiled the agreement Tuesday at the Intel Developer Forum in San Francisco. The accord will let Intel offer third-party semiconductor companies its most advanced 10-nanometer production lines for manufacturing the complex chips usually used in smartphones.

Intel, which receives most of its profits from its processor business, has failed to gain ground in the emerging smartphone market, which until now has been dominated by ARM. Under Chief Executive Officer Brian Krzanich, Intel is trying to persuade other chipmakers to use its factories for their production. Adding licenses for ARM’s technology could open up that business to fabricating chips based on those designs for companies such as Qualcomm Inc. and Apple Inc., which now have their chips produced by Taiwan Semiconductor Manufacturing Co. and others.

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Rumor: Next-gen MacBook to have smaller footprint, be thinner, incorporate Touch ID into power button

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Date: Wednesday, August 10th, 2016, 08:03
Category: Hardware, MacBook Pro, Rumor

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Some new details have begun to leak out about the next-gen MacBook Pro notebooks.

Sources have indicated that the new notebooks will have a smaller footprint than existing models, and will be thinner but not adopt the wedge shape of the MacBook Air and 12-inch MacBook. The trackpad is also slightly wider than current models. All of the info lines up with previous reports and a set of leaked shells from earlier this year.

The machines are said to already be ‘in advanced testing’ but will not launch until after the iPhone event in September, confirming earlier reports that said that the laptops were scheduled for release in quarter four.

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Intel announces Kaby Lake processors, chips may arrive too late for inclusion in next-gen MacBook Pro

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Date: Friday, July 22nd, 2016, 08:46
Category: Hardware, Intel, MacBook Pro, News, Processors

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The good news is that Intel announced its seventh-generation Core processors during yesterday’s second quarter earnings call yesterday.

The bad news is that the processors, known as “Kaby Lake”, which are made via a 14-nanometer process, might not see the Mac until 2017.

Intel’s last two chip releases have been plagued with long delays, and moving away from the tick-tock cycle will allow it to push out new chip updates on a regular basis. Apple’s Macs, such as the Retina MacBook Pro and the iMac, have been impacted by Intel’s chip delays over the last few years, resulting in long periods of time between updates and unusual update cycles.

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Bluetooth 5 standard to be announced next week, will double range, quadruple speeds

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Date: Friday, June 10th, 2016, 08:56
Category: Bluetooth, Hardware, News, Software

bluetooth

Bluetooth 5, the next generation of the Bluetooth standard, is set to be formally announced next week.

The standard will offer double the range and quadruple the speed of the current Bluetooth protocol.

Executive director of the Bluetooth Special Interest Group, Mark Powell, revealed the news in a published email this week. The Bluetooth SIG, which is backed by Apple, Intel, and other major technology companies, will officially make the announcement on June 16 in London.

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Rumor: Apple may switch away from Qualcomm for next-gen iPhone modems, could source from multiple vendors

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Date: Thursday, April 21st, 2016, 07:06
Category: Hardware, iPhone, Rumor

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It looks like Apple may be switching away from Qualcomm modems for its next-gen iPhones.

During Wednesday’s conference call to analysts, Qualcomm CEO Steve Mollenkopf said he is “assuming” a major Qualcomm customer will be giving modem orders to another company. While Mollenkopf didn’t mention Apple by name, Apple and Samsung are Qualcomm’s largest clients, and Samsung is already known to use multiple suppliers.

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Initial tests point to 15% faster CPU performance, other changes in 2016 12-inch Retina MacBooks

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Date: Wednesday, April 20th, 2016, 14:01
Category: Hardware, MacBook, News

12-inch-MacBook-Rose-Gold-color

Apple’s next-gen 12-inch retina MacBook is out the door and the numbers have been run on it.

Over at Geekbench, Christina Warren noted that that 1.2 GHz configuration runs around 15 to 18 percent faster CPU performance compared to last year’s equivalent model. The notebook earned a single-core score of 2,894 and a multi-core score of 5,845, versus 2,437 single-core and 5,049 multi-core scores for the previous generation 1.2GHz model.

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Rumor: iPhone 7 Plus could incorporate 256GB SanDisk NAND flash memory chip

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Date: Wednesday, March 16th, 2016, 09:12
Category: Hardware, iPhone, Rumor

SanDisk-256GB

It’s been speculated that Apple could sell an iPhone 7 Plus with 256GB of storage, the NAND flash memory chip hailing from SanDisk.

Italian website HDblog has shared pictures of a SanDisk 256GB NAND flash memory chip that could be appropriate for the next-generation smartphone.

Apple has used SanDisk flash memory chips in a number of previous iPhone models, including the iPhone 5, iPhone 6, and iPhone 6 Plus, while other models have used NAND flash chips from Samsung, SK Hynix, and Toshiba.

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Intel’s 3D Xpoint architecture could find its way into Mac notebooks fairly quickly, be significantly faster than NAND Flash storage

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Date: Monday, March 14th, 2016, 08:37
Category: Hardware, Intel, MacBook, MacBook Air, MacBook Pro, News

3D-XPoint

This could lead to something really nifty for your Mac notebook.

Last summer, Intel announced 3D Xpoint, a new class of memory labeled as a “major breakthrough in memory process technology.” 3D Xpoint is 1,000 times faster and more durable than NAND Flash storage, as well as 10 times denser than the DRAM chips used in computers.

The transistor-free cross point architecture essentially creates a three-dimensional checkerboard withers memory cells sit at the intersection of word lines and bit lines, allowing the cells to be addressed individually. As a result, data can be written and read in small sizes, leading to faster and more efficient read/write processes.

Intel had stated that the first 3D Xpoint product would be solid in early 2016 and marketed under the product name of its “Octane solid state drives”. Interestingly enough, 3D Xpoint is compatible with NVM Express (NVMe), an SSD protocol that offers improved latency and performance over the older AHCI protocol.

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Rumor: Intel may provide LTE modems for next-gen iPhones

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Date: Monday, March 7th, 2016, 07:28
Category: Hardware, iPhone, Rumor

IntelLogo

Intel is looking to be a provider of some dead-nifty LTE modems for the next-gen iPhone.

CLSA Securities analyst Srini Pajjuri has corroborated multiple reports claiming that Intel will supply LTE modems for the iPhone 7, according to a research note obtained by NDTV.

Pajjuri stated that Intel has acquired a “significant portion” of the LTE chips, this percentage thought to be around 30 to 40 percent of production. While supplier Qualcomm will be tasked with the remaining orders, Apple is apparently looking to cut some of its reliance on Qualcomm and is thus looking to Intel to pick up some of the slack.

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Thunderbolt 3, USB Type-C ports becoming more prevalent on high-end PCs

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Date: Monday, January 11th, 2016, 08:22
Category: Hardware, MacBook, MacBook Pro, News, Thunderbolt, USB-C

thunderbolt3

Thunderbolt 3 and USB Type-C look like they’re making their way from the Mac to high-end PCs.

Where Thunderbolt 3 is concerned, the port is suddenly beginning to show up in high-end offerings from just about every major PC OEM, starting with some Lenovo workstation laptops and Dell’s new XPS lineup and continuing in laptops and convertibles from HP, Acer, Intel, and others.

Over at CES, both Thunderbolt 3 and USB Type-C seem to be getting noticed, driving displays and charging notebooks on assorted display units throughout the convention.

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